Wire To Board Connector

● General information

  ‧Composition: Wafer; Housing & Terminal
  ‧Application: Communication; Computer & Consumer electronics device
  ‧Substitution: LED wafer

● Features

 ‧Wide range of pitch for board-to-board and AGW for wire-to-board for option
  ‧Mounting system: SMT or DIP
  ‧UL, RoHS & Halogen-free compliant

● Design Standard

	pitch 1.00 mm (pdf 687K)
	pitch 1.20 mm (pdf 1262K)
	pitch 1.25 mm (pdf 3114K)
	pitch 1.50 mm (pdf 1282K)
	pitch 1.80 mm (pdf 676K)
	pitch 2.00 mm (pdf 2506K)
	pitch 2.50 mm (pdf 1909K)
	pitch 3.96 mm (pdf 644K)